2008 Packaging Automation Forum in Chicago Features OMAC Make2Pack Workshop. 

End Users, OEMs and Solutions Providers from over 80 companies participated in the Packaging Automation Forum held May 19-20, 2008, to share their ideas and provide feedback.   Topics included the Make2Pack standards as well as the Connect-and-Pack initiative that will be used by the packaging industry to develop and support factory floor automation.

Lead by Make2Pack chairman Dave Chappell and supported by Rob Aleska of Proctor & Gamble who provided an end user perspective, the event detailed the importance of these standards and how they may impact your business operations. Schneider Electric and our packaging automation specialists ELAU, also participated in this event and continue to work with OEMs and end-users to leverage these standards to be more competitive.

The Make2Pack and Connect-and-Pack standards do several things to help both groups including:

• Driving down startup and life cycle costs.
• Accelerating innovation.
• Improving information collection.

If you were unable to attend this educational workshop in Chicago but would still like to learn more about the standardization efforts, you can download the presentations as well as scripted-demonstrations from each of the automation suppliers at OMAC.org website. You can also contact your Schneider Electric or ELAU representative for more information on how we can work together to take advantage of these and other packaging solutions. 

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