November 2008
What’s hot at PACK EXPO 2008?
Delta robots, swirl fillers, sustainable packaging, totally automated changeovers — Experience packaging machinery innovation at PACK EXPO 2008, November
9-13 at McCormick Place in Chicago, Il. The staff at Packaging Automation, the online news magazine, has highlighted some of the hottest new machines for 2008 and beyond in their preview edition, available now!
Don’t forget to pick up your official PMMI PACK EXPO floor plan at Schneider Electric’s Booth #E-6413 and every entrance. The floor plans highlight, in blue, Schneider Electric ELAU Packaging Solutions. These Packaging Solutions help maximize effectiveness and can help make your solutions more competitive.
> Visit Packaging Automation, the online news magazine.
Product Focus: The first truly integrated automation architecture
The Schneider Electric ELAU PacDrive solution provides motion, logic, programmable limit switches, temperature control and even robotic kinematics in a single package. There are no performance-degrading add-on hardware modules, backplanes or software integrations and a centralized control assures the fastest possible response times and servo axis counts. Our PacDrive solution can handle your most ambitious throughput and changeover requirements -- with power left over to serve up MES data, synchronize your line, and perform efficiency monitoring. > Visit Schneider Electric’s packaging website to learn more.
Visit us at: http://www.us.schneider-electric.com/packaging
Contact us: packaging@us.schneider-electric.com
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